Warmup Insulated Underlay Underfloor Heating System

The Warmup Insulated Underlay is what you need alongside your Underfloor Heating system. 6mm thick, it is composed of a grooved polystyrene top layer and bottom layer of silver foil with adhesive overlap. Its primary function is to sit between the cold subfloor and foil heater reflecting heat upwards, and thus making the underfloor heating system more efficient. The foil backing creates an effective moisture barrier while the polystyrene insulation reduces contact noise. It is perfect for carpets and vinyl floor covering, under foil underfloor heating. Now available from your preferred shopping destination www.qssupplies.co.uk

• A thin polystyrene insulation barrier with effective acoustic properties to reduce contact noise
• Heat loss resistance: Increases the energy efficiency of your underfloor heating system by pushing the heat-upwards
• Very thin: Only 6mm in depth
• Lightweight: Easy to install
• Ideal with dual overlay for soft floor covers: Helps you to make the most of your foil heater by creating a highly energy-efficient heating system and soundproofed floors
• It sits between the cold subfloor and foil heater, reflecting heat upwards, making the underfloor heating system more efficient and effective
• The foil backing acts as an effective moisture barrier
• More coverage area sizes are available [See Option]
• Technical Specification:
• Size: Width 1200mm x Coverage area
• Thickness: 6mm +/- 0.5
• Composition: Top Layer - Grooved EPS, Bottom Layer - Silver foil with adhesive overlap
• Rm Value: 0.17sqm k/w
• Contact Sound Reduction: 21dB ΔLw When used in conjunction with Warmup dual overlay
• Temperature reach: -30 deg C up to +70 deg C
• Thermal Conductivity: 0.033 W/m.K
• Density: 18 kg/m³
• TOG: 1.7
• Fire Class EN13501: Bfl
• Water Vapour Diffusion resistance (SD): > 100

Please Note:*In case of floating substrate systems the sound reduction of the finished floor covering will always depend on the impact sound reduction of the existing substrate.